Influences of electrode material and design on the reliability of IRFPAs detector under thermal shock
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DOI: 10.1007/s11082-017-0908-8
Abstract: Under thermal shock, high fracture probability in indium antimonide (InSb) infrared focal plane arrays (IRFPAs) limits its applicability. Typical fracture photographs under thermal shock shows that the cracks originating from the area above public electrode… read more here.
Keywords: thermal shock; insb; electrode material; electrode ... See more keywords