A low‐cost, solution‐processed, versatile, microfluidic approach is developed for patterning structures of highly conductive metals (e.g., copper, silver, and nickel) on chemically modified flexible polyethylene terephthalate thin films by in… Click to show full abstract
A low‐cost, solution‐processed, versatile, microfluidic approach is developed for patterning structures of highly conductive metals (e.g., copper, silver, and nickel) on chemically modified flexible polyethylene terephthalate thin films by in situ polymer‐assisted electroless metal deposition. This method has significantly lowered the consumption of catalyst as well as the metal plating solution.
               
Click one of the above tabs to view related content.