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Low‐viscosity and soluble phthalonitrile resin with improved thermostability for organic wave‐transparent composites

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High processing viscosity and poor solubility limit the application of heterocyclic polymers for fabricating organic wave-transparent composites for aerospace applications. In this paper, a novel resin, poly(phthalazinone ether bisphenol fluorene)… Click to show full abstract

High processing viscosity and poor solubility limit the application of heterocyclic polymers for fabricating organic wave-transparent composites for aerospace applications. In this paper, a novel resin, poly(phthalazinone ether bisphenol fluorene) encapped with phthalonitrile (PPEBF-Ph), was synthesized and used as the matrix. Biphenol-based phthalonitrile monomer BP-Ph was also synthesized and blended with PPEBF-Ph to further lower the processing viscosity. Solubility tests showed that the resin was soluble in dimethylformamide, N,N-dimethyl acetamide, N-methylpyrrolidone, dimethyl sulfoxide, chloroform, and other solvents. Differential scanning calorimetry and rheological studies revealed that the mixed resins exhibited low processing viscosity and a wide processing window below the gel temperature. Thermogravimetric analysis indicated that the cured resins were stable below 510–530 °C under nitrogen atmosphere after 6 h of curing (decreased by 40–60% compared with previous reports on phthalonitrile resin). In air, the char yields of the resins reached 20–30% when heated at 800 °C. The composites were reinforced by a quartz fiber cloth and exhibited a dielectric constant of 2.94–3.27 in an electromagnetic field with frequency ranging from 8 to 18 GHz. Retention of the bending modulus exceeded 70% at 400 °C according to dynamic mechanical analysis, indicating excellent mechanical stability was obtained. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 45976.

Keywords: resin; viscosity; phthalonitrile resin; organic wave; wave transparent; transparent composites

Journal Title: Journal of Applied Polymer Science
Year Published: 2018

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