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Sub-micro Organosolv lignin as bio-based epoxy polymer component: A sustainable curing agent and additive.

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Sub-micro organosolv lignin (OBs) isolated from beechwood biomass, comprising of sub-micro sized particles (570 nm), with low molecular weight (Mw) and dispersity (Ð), and relatively high total phenolic -OH content,… Click to show full abstract

Sub-micro organosolv lignin (OBs) isolated from beechwood biomass, comprising of sub-micro sized particles (570 nm), with low molecular weight (Mw) and dispersity (Ð), and relatively high total phenolic -OH content, was successfully utilized for the production of bio-based epoxy polymer composites. OBs lignin was incorporated in the glassy epoxy system based on diglycidyl ether of bisphenol A (DGEBA) and aliphatic polyoxypropylene α,ω-diamine (Jeffamine D-230), being utilized both as curing agent replacing partially D-230 as well as an additive, substituting part of both petroleum derived components. Up to 12 wt.% replacement of D-230 by OBs lignin was achieved, while a total of ~17 wt.% of OBs effectively replaced the conventional epoxy polymer. The incorporation of OBs lignin in the polymeric matrix was achieved without the use of any solvent or previous functionalization. Enhanced properties were obtained, with substantial increase of tensile strength, strain, and stiffness, Tg, antioxidant activity and resistance to solvents.

Keywords: sub micro; organosolv lignin; epoxy polymer; micro organosolv

Journal Title: ChemSusChem
Year Published: 2023

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