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Transient flow and heat transfer mechanism for Williamson-nanomaterials caused by a stretching cylinder with variable thermal conductivity

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The utilization of nanometre-sized solid particles in working fluids has been seriously recommended due to their enhanced thermal characteristics. This suspension of solid particles in base fluids can significantly enhance… Click to show full abstract

The utilization of nanometre-sized solid particles in working fluids has been seriously recommended due to their enhanced thermal characteristics. This suspension of solid particles in base fluids can significantly enhance the physical properties, such as, viscosity and thermal conductivity. They are widely used in several engineering processes, like, heat exchangers, cooling of electronic equipment, etc. In this exploration, we attempt to deliver a numerical study to simulate the nanofluids flow past a circular cylinder with convective heat transfer in the framework of Buongiorno’s model. A non-Newtonian Williamson rheological model is used to describe the behavior of nanofluid with variable properties (i.e., temperature dependent thermal conductivity). The leading flow equations for nanofluid transport are mathematical modelled with the assistance of Boussinesq approximation. Numerical simulation for the system of leading non-linear differential equations has been performed by employing versatile, extensively validated, Runge–Kutta Fehlberg scheme with Cash–Karp coefficients. Impacts of active physical parameters on fluid velocity, temperature and nanoparticle concentration is studied and displayed graphically. It is worth to mention that the temperature of non-Newtonian nanofluids is significantly enhanced by higher variable thermal conductivity parameter. One major outcome of this study is that the nanoparticle concentration is raised considerably by an increasing values of thermophoresis parameter.

Keywords: variable thermal; cylinder; thermal conductivity; heat transfer; conductivity

Journal Title: Microsystem Technologies
Year Published: 2019

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