LAUSR

AbstractLowering the sintering temperature of nanoparticles in the electrode deposition process holds both academic and industrial interest because of the potential applications of such electrodes in polymer devices and flexible electronics. In addition, achieving uniform electrode formation after ligand exchange is equally important as lowering the sintering temperature. Here, we report a simple chemical treatment by the addition of ligand-exchanging interfaces to lower the sintering temperature; we also determine the optimum extent of ligand exchange for crack-free electrode formation. First, we investigated the structural change of Ag thin films with respect to the concentration of acrylic acid (AA) solutions. Second, we used thermal analysis to evaluate the effects of changes in the sintering temperature. We observed that the resulting conductivity of the Ag patterns was only one order of magnitude lower than that of bulk Ag when the patterns were sintered at 150 °C. The simple chemical treatment developed in this work for solution-processed Ag electrode formation can be adopted for flexible electronics, which would eliminate the need for vacuum and high-temperature processes. Graphical abstractWe report the optimum extent of ligand exchange on Ag nanoparticles from oleylamine to acrylic acid for achieving uniform Ag thin film and low-temperature sintering.