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Structure Evolution of Slag Films of Ultrahigh-Basicity Mold Flux During Solidification

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A higher-basicity mold flux (binary basicity 1.74) for peritectic grades showed similar solidification behavior to conventional high-basicity fluxes. Upon solidification of the mold flux onto a water-cooled copper probe, interfacial… Click to show full abstract

A higher-basicity mold flux (binary basicity 1.74) for peritectic grades showed similar solidification behavior to conventional high-basicity fluxes. Upon solidification of the mold flux onto a water-cooled copper probe, interfacial roughness at the copper-mold flux interface developed, while the film was glassy. Cuspidine was the major crystalline phase (as for conventional fluxes), but with a lathlike shape, containing some aluminum.

Keywords: basicity mold; basicity; mold flux; solidification

Journal Title: Metallurgical and Materials Transactions B
Year Published: 2017

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