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In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging… Click to show full abstract
In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at 150°C. Thermodynamically stable intermetallics (IMCs) Cu-Zn and Cu-Sn formed at the interface depending on the solder composition. Formation of different interfacial IMCs during soldering and after prolonged aging is explained by the spalling mechanism that resulted from the depletion of Zn from the solder matrix.
Keywords:
interfacial intermetallics;
concentration interfacial;
liquid solid;
solder;
influence concentration;
intermetallics liquid
Journal Title: Journal of Electronic Materials
Year Published: 2019
Link to full text (if available)
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Journal Title: Journal of Electronic Materials
Year Published: 2019
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!