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Diffusion Bonding of TiAl to Ti6Al4V Using Nanolayers

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Microstructural characterization of TiAl to Ti6Al4V dissimilar diffusion bonds assisted by reactive Ni/Al nanolayers was performed in this study. The nanolayers (alternated Al and Ni) were deposited onto the base… Click to show full abstract

Microstructural characterization of TiAl to Ti6Al4V dissimilar diffusion bonds assisted by reactive Ni/Al nanolayers was performed in this study. The nanolayers (alternated Al and Ni) were deposited onto the base material surfaces. Diffusion bonding was performed at 700 and 800 °C under pressures from 5 to 40 MPa and dwell times between 60 and 180 min. Microstructural characterization was performed using high-resolution transmission and scanning electron microscopies. The observations revealed that dissimilar TiAl to Ti6Al4V joints assisted by Ni/Al reactive nanolayers can be obtained successfully at 800 °C during 60 min using a pressure of 20 MPa. The bond interface is thin (less than 10 µm) and is mainly composed of NiAl grains. Thin layers of Al-Ni-Ti intermetallic compounds were formed adjacent to the base materials.

Keywords: ti6al4v using; bonding tial; ti6al4v; tial ti6al4v; diffusion bonding

Journal Title: Journal of Materials Engineering and Performance
Year Published: 2018

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