LAUSR

The heat transfer performance of a vapor chamber and its effectiveness in the cooling of electronic devices are experimentally and theoretically investigated in the present work. The power transistor in the circuit board usually operates with electric power that ranges from 15 W to 100 W, which is the heat input to the simulated processor. The heat flux varies between 3300 and 22000 W/m2. The simulated processor is cooled with the forced and induced air cooling methods with and without the use of the vapor chamber. Results show a maximum temperature decrease of 26 % and a maximum increase in the convective heat transfer coefficient of 36 %. The minimum value of the thermal resistance through the vapor chamber and the total thermal resistance is 0.195 and 0.82 °C/W, respectively. The experimental results are compared with the ANSYS predicted values.