LAUSR

Electrochemical discharge machining (ECDM) is a versatile machining process due to its applicability to machine different materials regardless to their properties. In this work, machining behaviour of silicon wafer using ECDM is presented. An attempt has been made to drill micro holes on silicon wafer considering applied voltage and tool feed rate as input process parameters. The overcut and hole taper were observed as output quality characteristics. The experimental results revealed that overcut and hole taper increase with increase in voltage and decreases with increase in tool feed rate. The characterization of micro holes has been carried out using scanning electron microscopy and revealed the presence of small debris, overcut and heat affected zone on machined surface. Overall, it was observed that micro hole machined at conditions i.e. applied voltage 60 V, tool feed rate 250 μm/min results in minimum overcut and hole taper. The axial, lateral and flank erosion was observed on the micro tool used for machining of silicon wafer.