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A Micromechanics-Based Hierarchical Analysis of Thermal Conductivity of Metallic Nanocomposites with Agglomerated Ceramic Nanoparticles

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The influence of agglomeration of SiC nanoparticles on the bulk thermal conducting behavior of aluminum (Al)-based nanocomposites is examined using a micromechanics-based hierarchical technique. The interfacial thermal resistance (ITR) between… Click to show full abstract

The influence of agglomeration of SiC nanoparticles on the bulk thermal conducting behavior of aluminum (Al)-based nanocomposites is examined using a micromechanics-based hierarchical technique. The interfacial thermal resistance (ITR) between the ceramic nano-scale particles and the metallic matrix is included in the analysis. The predictions of the micromechanical model considering the agglomeration and ITR are in very good agreement with the available experimental results. The agglomeration of ceramic nanoparticles greatly reduces the thermal conducting coefficient of the Al-based nanocomposites. When the nanoparticle volume fraction is 10%, the thermal conductivity decreases from 132 to 115 W/mK with the formation of nanoparticle agglomeration. The uniform distribution of nanoparticles and the elimination of ITR can lead to a substantial enhancement in the nanocomposite thermal conductivity. When the volume fraction is 10%, the thermal conductivity increases from 115 to 188 W/mK by uniform dispersing the nanoparticles and removing the SiC/Al ITR. Moreover, the effects of amount, and diameter of nano-scale particles as well as the constituent material properties on the bulk thermal conductivity of the SiC nanoparticle-filled Al nanocomposites are examined. When the SiC diameter increases from 35 nm to 3.5 µm, the thermal conductivity of the Al-based composite increases from 132 to 173 W/mK.

Keywords: ceramic nanoparticles; based hierarchical; thermal conductivity; micromechanics based; conductivity; analysis

Journal Title: Arabian Journal for Science and Engineering
Year Published: 2021

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