LAUSR

Abstract Grinding process of monocrystalline silicon easily leads to fractured surfaces, therefore an analytical model of the ground silicon surface is presented. In the model, the ductile-regime effect is considered by determining grain-workpiece interaction mode (ductile and brittle modes) at each grinding moment. Validation experiments proved that the model can, to a large extent, describe realistic silicon grinding and predict the machined surfaces in terms of (i) brittle and ductile area, (ii) roughness and waviness, and (iii) potential chipping zone sizes. The model therefore is anticipated to be not only meaningful to guide and optimize the industrial silicon grinding process, but also transferable to other kinds of brittle materials.