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Multiscale study of different types of interface of a buffer material in powder-based directed energy deposition: Example of Ti6Al4V/Ti6Al4V - Mo/Mo - Inconel 718

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Abstract When it is difficult to deposit a material A on a material B, it is possible to create a Functionally Graded Material (FGM) using a buffer material between them… Click to show full abstract

Abstract When it is difficult to deposit a material A on a material B, it is possible to create a Functionally Graded Material (FGM) using a buffer material between them to avoid the appearance of defects. The literature shows that it is very difficult, nay impossible, to have an efficient metallurgical bond between Ti6Al4V and Inconel-Mo alloys without cracks, porosities or delamination. A buffer material is therefore needed (here 25% Ti6Al4V – 75% Mo) and the fine analysis of the two interfaces thus created makes it possible to define the relevance of the choice of the buffer. Moreover, the understanding of the phenomena taking place at the interface allows the preservation of the structural integrity of a FGM made by additive manufacturing. CLAD® powder-based directed energy deposition allows the building of parts containing FGM and/or buffer materials directly during the process. The study of the interfaces at both sides of the buffer material is essential. In this paper, the first interface 100 Ti6Al4V / 25 Ti6Al4V – 75 Mo (in wt%) is smooth, suggesting that there has been diffusion between both alloys. The second one, 25 Ti6Al4V – 75 Mo / 30 Inconel 718 – 70 Mo, contains numerous exotic structures between both alloys. For such a sharp interface, we show in this paper that a microscopic study is not sufficient, but a finer scale is necessary to have a good metallurgical insight. Thus, EDS, TKD and X-ray crystallography were performed right on this interface and revealed three main structures: a hexagonal matrix, a cubic structure and an ordered hexagonal one. The hexagonal matrix appears to consist of Ni3Ti and the ordered hexagonal one of NiMo.

Keywords: buffer material; powder based; ti6al4v inconel; study; ti6al4v

Journal Title: Additive Manufacturing
Year Published: 2019

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