LAUSR

Abstract Direct writing a thermosetting resin typically requires a rheological modifier or peripheral reaction rate-modulating equipment to enable shape fidelity during parts fabrication. This work describes the processing and characterization of low molecular weight diamide-based derivatives of hydroxystearic acid to facilitate direct writing of an epoxy resin. These low molecular weight gelators (LMWG) are thermally activated to produce sufficient yield stress for self-supporting, reactive, physical gels. These organic gelators are semi-crystalline and enable two modes of processing to produce form-stable resin formulations – cold processing and melt processing. Physical gelation occurs by assembly of the LMWG into supramolecular morphologies [ 1 ] that vary by mode of processing. Flow of the form-stable epoxy resin is induced by yielding of the physical gel structure. When the physical gel is cured at temperatures below the melt transition of the organic gelator, the network structure likely kinetically traps the organic gelator in a metastable state. Recrystallization of the kinetically trapped organic gelator is impeded when the network is post-cured above the melt transition temperature of the organic gelator. The use of low molecular weight agents that physically gel by thermal activation, generates low viscosity solution processability and suggests that this platform may be suitable for high solids loading applications amenable to direct writing.