LAUSR

Abstract To address the challenge of heat management for high-power IGBTs, a type of microchannel liquid cooling heat sinks integrated vapor chamber (VC integrated heat sink) was developed. Firstly, it compared with the VC separate heat sink and the simple microchannel heat sink under the same conditions. The experimental results showed that the VC integrated heat sink had less thermal resistance than the VC separated heat sink, and the relatively simple microchannel heat sink could significantly improve the temperature uniformity. The influence of the cooling water flow rate, temperature and inclination angle on the VC integrated heat sink was further studied. Reductions in the cooling water temperature led to decreases in the heat source temperature but did not improve temperature uniformity. The inclination angle had a significant influence on the performance of the VC integrated heat sink. The performance of the VC integrated heat sink was optimal when the inclination angle was 60°.