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Effect of processing factors on the microstructure and gradual diffusion of tungstenized layers

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Abstract The refractory tungsten (W) coating due to its low sputtering yield is not easy to be obtained, and the bonds between the W coating and its substrate are weak… Click to show full abstract

Abstract The refractory tungsten (W) coating due to its low sputtering yield is not easy to be obtained, and the bonds between the W coating and its substrate are weak and easily broken. A novel gradual tungstenized layer as the plasma facing armor material is prepared by using the double glow plasma surface alloying technology (DGPA). The effects of process factors on the microstructure and micro-hardness of the alloyed layers are investigated. It is found that TixW1-x gradual layers are formed in the alloyed layer. Due to the fact that the tungsten content in the gradual tungstenized layer gradually decreases from surface to the substrate, the layer is composed of both pure tungsten coating and transitional coatings (e.g. TixW1-x (x > 0.5) and TixW1-x (x

Keywords: factors microstructure; effect processing; microstructure gradual; processing factors; layer; gradual diffusion

Journal Title: Applied Surface Science
Year Published: 2019

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