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Transmission electron microscopy and high-resolution electron microscopy studies of structural defects induced in Si single crystals implanted by helium ions at 600 °C

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Abstract The implantation-induced defects of crystalline silicon implanted with helium ions to a dose of 5 × 1016/cm2 at 600 °C were investigated. The sample was analyzed by transmission electron microscopy and high-resolution… Click to show full abstract

Abstract The implantation-induced defects of crystalline silicon implanted with helium ions to a dose of 5 × 1016/cm2 at 600 °C were investigated. The sample was analyzed by transmission electron microscopy and high-resolution electron microscopy. Faceted cavities are observed in the damaged layer. Concurrently the distribution of interstitial-type defect clusters was investigated by conventional electron microscopy in bright and dark field. Many rod-like defects, which belong to {1 1 3}, {1 1 1} and (−2 0 0), are formed in the end of the projected range. In front of the damaged layer, some ribbon-like defects are formed, which belong to 〈2 0 0〉, 〈1 −1 1〉 and 〈1 3 −3〉. The possible reasons of the observed defect clusters are discussed.

Keywords: helium ions; microscopy; electron microscopy; implanted helium; transmission electron

Journal Title: Applied Surface Science
Year Published: 2018

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