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Abstract Pure Cu film strongly adherent to glass substrates was deposited by printing Cu(COOH)2-containing paste and decomposing it at 250 °C in nitrogen atmosphere. The complete transformation of Cu(COOH)2 into Cu… Click to show full abstract
Abstract Pure Cu film strongly adherent to glass substrates was deposited by printing Cu(COOH)2-containing paste and decomposing it at 250 °C in nitrogen atmosphere. The complete transformation of Cu(COOH)2 into Cu required 30 min and generated a low sheet resistance of 0.167 Ω/sq (volume resistivity: 15.0 μΩ·cm). Maximum adhesion between the Cu film and substrate was attained at the Cu complexes:α-terpineol mixing ratio of 6:4 by weight. The spike-shaped microstructure at the Cu/glass interface was determined to be the main cause for the outstanding adhesion properties. The resistance further decreased to 0.084 Ω/sq by increasing the thickness and modifying the surface of the Cu film via electroless Cu plating.
Journal Title: Applied Surface Science
Year Published: 2019
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