LAUSR.org creates dashboard-style pages of related content for over 1.5 million academic articles. Sign Up to like articles & get recommendations!

Electrochemical tailoring of Pb-free Sn coatings modified with SiC nanoparticles by surfactant-assisted reverse pulse plating

Photo from wikipedia

Abstract In this study, reverse pulse plating technique was used to study the effect of various surfactants (anionic, non-ionic, and cationic) in electrolytes and incorporation of SiC nanoparticles (NPs) in… Click to show full abstract

Abstract In this study, reverse pulse plating technique was used to study the effect of various surfactants (anionic, non-ionic, and cationic) in electrolytes and incorporation of SiC nanoparticles (NPs) in the Sn matrix. The microstructural and electrochemical observations indicate that the incorporation of SiC in Sn coating depends upon the type of surfactants. The composite stress moves from compressive to tensile with SiC content. The maximum grain refinement of Sn-SiC coatings was found in the presence of a cationic surfactant in the electrolyte while a minimum value of resistivity was displayed by coatings prepared in anionic surfactant. The corrosion behavior of Sn-SiC coatings showed superior corrosion protection ability of non-ionic surfactants amongst other surfactants used here.

Keywords: reverse pulse; pulse plating; electrochemical tailoring; sic nanoparticles

Journal Title: Applied Surface Science
Year Published: 2021

Link to full text (if available)


Share on Social Media:                               Sign Up to like & get
recommendations!

Related content

More Information              News              Social Media              Video              Recommended



                Click one of the above tabs to view related content.