LAUSR

Abstract This paper focuses on evaluating the influence of thick films on the electrical properties of ceramic substrates, especially their dielectric strength. Dielectric strength is one of the most important parameters of the substrates used in power electronics. Increasing the thickness of the conductive films on these substrates is necessary to achieve sufficient current capability. The glass phase of thick film metal pastes, particularly if they are printed and fired several times on the same area of the substrate, can significantly affect the dielectric strength value and other electrical parameters (resistivity, dielectric constant) of the substrates. The change of the substrate parameters using different thicknesses of copper (thick printed copper) and silver films is described in this paper.