LAUSR

Abstract Tungsten-Rhenium (W-Re) thin films were grown on alumina ceramic substrate using the magnetron sputtering technique. The feasibility and reliability of the tungsten-rhenium thin film thermocouples application are largely dependent on the adhesion properties between the W-Re film and substrate. In order to get the good adhesion, we researched the effect of magnetron sputtering parameters on adhesion properties of tungsten-rhenium thin film thermocouples. With the help of three factors and three levels orthogonal table, nine orthogonal experiments were designed to study the influences of argon flow rate, sputtering power and vacuum degree on the performance of adhesion. The result showed that the effect of vacuum degree on adhesion properties was the largest, then come sputtering power, while the effect of the argon flow rate was the least and the optimal parameters combination was: argon flow rate 30 Sccm, sputtering power 400 W and vacuum degree 0.7 × 10−6 Torr.