Abstract Atomic layer deposition (ALD) of SnO and SnO 2 thin films was successfully demonstrated over a wide temperature range of 70–300 °C using a divalent Sn-precursor, bis( N- ethoxy-2,2-dimethyl propanamido)tin… Click to show full abstract
Abstract Atomic layer deposition (ALD) of SnO and SnO 2 thin films was successfully demonstrated over a wide temperature range of 70–300 °C using a divalent Sn-precursor, bis( N- ethoxy-2,2-dimethyl propanamido)tin (Sn(edpa) 2 ). The regulated growth of the SnO 2 and SnO films was realized by employing O 2 -plasma and H 2 O, respectively. Pure SnO 2 and SnO films were deposited with negligible C and N contents at all the growth temperatures, and the films exhibited polycrystalline and amorphous structures, respectively. The SnO 2 films presented a high transmittance of > 85% in the wavelength range of 400–700 nm and an indirect band gap of 3.6–4.0 eV; meanwhile, the SnO films exhibited a lower transmittance of > 60% and an indirect band gap of 2.9–3.0 eV. The SnO 2 films exhibited n-type semiconducting characteristics with carrier concentrations of 8.5 × 10 16 –1.2 × 10 20 cm −3 and Hall mobilities of 2–26 cm 2 /V s. By employing an alternate ALD growth of SnO and SnO 2 films, SnO 2 /SnO multilayer structures were successfully fabricated at 120 °C. The in-situ quadrupole mass spectrometry analysis performed during ALD revealed that the oxidation of chemisorbed Sn-precursor occurs dominantly during the Sn(edpa) 2 /O 2 -plasma ALD process, resulting in the production of combustion by-products, whereas the Sn(edpa) 2 /H 2 O ALD process was governed by a ligand exchange reaction with the maintenance of the original oxidation state of Sn 2+ .
               
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