LAUSR

Abstract Carbon films prepared by polyimide (PI) films treated under 1500°C exhibit favorable thermal conductivity. However, the bonds of carbon films will fracture and recombine which will cause shrinking and forming defects. The flexibility of the carbon films will be greatly reduced, and then affect the application of the carbon films in the field of thermal conduction. When the films prepared by the graphene oxide/polyimide (GO/PI) composite films and the reduced graphene oxide/polyimide (rGO/PI) composite films, respectively, rGO and GO can fill the defects, then increasing the flexibility of the carbon films and inducing the carbonation process. Because of the high thermal conductivity and the six-membered ring structure of rGO and GO, the carbonization temperature will decrease and save costs. When the composite films treated under 1500°C, the thermal conductivity increases with the content of rGO and GO. There are connections between PI and graphene. As the amount of rGO and GO increases, the strong interactions between the rGO or GO and PI lead to contact that enhances its thermal conductivity. However, the rGO and GO have different effects on the films flexibility and thermal conductivity and the differences will be described in the article.