LAUSR

Abstract Stoichiometric TiC and Cu are naturally non-wetting thus hindering application of the TiC-reinforced phase in Cu-matrix composites. In this study, stoichiometric TiC was converted to sub-stoichiometric TiCx through ball milling. The TiCx reinforced the Cu matrix after electropulsing-assisted flash sintering. When the content of C atoms in TiCx is sufficiently low, TiCx can form a good metallurgical bond with the Cu matrix. The hardness of the pure Cu matrix increased from 124 HV to 280 HV, and the strength increased from 347 MPa to 580 MPa when reinforced by 10 wt.% TiC0.6. The activity of Ti in TiC0.6 with a low carbon content is enhanced; thus, its dissolution in the Cu liquid melt is increased. The Ti atoms in liquid Cu facilitates interface bonding. The use of sub-stoichiometric TiCx to strengthen Cu-matrix composites is a promising strategy to expand the application of Cu-matrix composites.