Abstract Thermal management is a crucial issue for the reliability and life of the electronic devices. In this study, we successfully fabricated aluminum (Al) matrix composites with Cu networks (CNs)… Click to show full abstract
Abstract Thermal management is a crucial issue for the reliability and life of the electronic devices. In this study, we successfully fabricated aluminum (Al) matrix composites with Cu networks (CNs) using a straightforward way. Graphite flakes (GFs) and CNs coated with graphene (CNs@Gr) were used to improve the performance of Al-matrix composites by hot-pressing method. There-dimensional (3D) CNs@Gr in the composites displayed an effective thermal transfer pathway in the matrix. The thermal conductivity (TC) of Al/GFs/CNs@Gr-5 composites (482.14 W/m·K) at a low Gr content, which has increased about 103.4% compared to pure Al. The synthesized CNs@Gr networks with continuous dendritic structure can serve as high-efficiency thermal transfer pathways to enhance heat dissipation through Gr layers, which reduced interfacial resistance for phonon scatterings. Furthermore, all fabricated composites displayed a lower coefficient of thermal expansion (less than 2.5 × 10−5) (CTE) than pure Al matrix (below 340℃). As a result, the construction of 3D networks in Al-matrix composites with high comprehensive performance makes them promising thermal management materials.
               
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