Abstract Thermal cycling behavior of thermal barrier coatings deposited on Hf-doped (Ni,Pt)Al bond coats were investigated, comparing with conventional (Ni,Pt)Al at 1100 °C, to elucidate the effect of Hf addition into… Click to show full abstract
Abstract Thermal cycling behavior of thermal barrier coatings deposited on Hf-doped (Ni,Pt)Al bond coats were investigated, comparing with conventional (Ni,Pt)Al at 1100 °C, to elucidate the effect of Hf addition into (Ni,Pt)Al bond coat on failure mode of TBCs. The results revealed that thermal cycling resistance of TBCs was significantly improved with addition of Hf, where relatively lower oxidation rate constant and decreased scale rumpling tendency were achieved. The effects of Hf incorporation on scale rumpling tendency and failure modes of the TBCs were discussed. Moreover, residual stress, Young’s modulus and hardness in top coat were determined with increasing thermal cycles.
               
Click one of the above tabs to view related content.