Abstract Understanding the mechanism of interfacial heat transfer is the key to improved thermal conductivity of diamond/copper composites. Diamond particles are etched via molten salt to obtain different surface roughness… Click to show full abstract
Abstract Understanding the mechanism of interfacial heat transfer is the key to improved thermal conductivity of diamond/copper composites. Diamond particles are etched via molten salt to obtain different surface roughness and are subsequently coated with dual layers of tungsten and copper (Cu). Then, diamond/Cu composites are prepared by hot pressed sintering. When the (111)D surface roughness of the diamond is 11.1 μm, a maximum thermal conductivity of 602 W·m−1·K−1 is obtained, which is 12% higher than that of un-etched diamond/Cu composites. The roughness significantly increases the coupling area between the diamond and the Cu matrix, providing more heat transfer channels and a secondary heat transfer process at the diamond/matrix interface. The preparation of the high-thermal-conductivity composites is thus enhanced by controlling the surface roughness of the diamond particles.
               
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