Abstract This paper reports a novel ALD-AlOx/PECVD-SiNx bi-layer structure to passivate the surface channels of the hydrogen terminated diamond transistors. The upper SiNx was selectively etched to fabricate the robust… Click to show full abstract
Abstract This paper reports a novel ALD-AlOx/PECVD-SiNx bi-layer structure to passivate the surface channels of the hydrogen terminated diamond transistors. The upper SiNx was selectively etched to fabricate the robust T-shaped gates, while the lower thin AlOx with high quality was retained as the gate insulator. The fabricated device with gate length of 0.3 μm demonstrated a high current density of 715 mA/mm, a low on-resistance of 8 Ω·mm, and an extrinsic fT/fmax of 10/20 GHz. RF power output characteristics were investigated at 2 GHz and a maximum output power density of 703 mW/mm was obtained at a low drain voltage of −15 V. It reveals that it is a promising solution for high stable and high power diamond RF transistors and microwave integrated circuits by using the AlOx/SiNx passivation structure.
               
Click one of the above tabs to view related content.