LAUSR

Abstract The transient response of a piezoelectric layer bonded to an orthotropic layer under anti-plane mechanical and in-plane electrical impacts is investigated in this paper. The problem consist of two parts. In the first part, the analysis is based on the stress and electric displacement fields caused by electro-elastic dislocation in the piezoelectric layer, while the second part consist of the interfacial crack formulation by introducing the dislocation situated at the interface of two bonded layers. For both problems, the dislocation solution are obtained utilizing Fourier and Laplace transforms. These solutions lead naturally to singular integral equations for dislocation density functions in the both cases of embedded and interface cracks. The integral equations are solved numerically to obtain dislocation density functions on the surface of crack, which are used to calculate dynamic field intensity factors.