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Intensity of singular stress field (ISSF) variation as a function of the Young's modulus in single lap adhesive joints

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Abstract Employing mixed adhesive joints has been proven to be very useful. This type of joint leads to improved performance by increasing strength and decreasing stresses in critical areas of… Click to show full abstract

Abstract Employing mixed adhesive joints has been proven to be very useful. This type of joint leads to improved performance by increasing strength and decreasing stresses in critical areas of the joint. In the same way, the use of the Intensity of Singular Stress Field (ISSF) has been shown to be suitable for adhesive joint calculation, since the adhesive strength can be controlled by the ISSF at the interface end. Four finite element models have been created by combining two epoxy adhesives with different mechanical properties, and therefore with different Young's moduli. New mixed adhesive joints have been compared with respect to only-one adhesive joints in terms of the ISSF. The results show a clear improvement with one of the configurations of mixed adhesive joints. A significant decrease of 35.64% in the ISSF is obtained compared to the only-one adhesive configuration.

Keywords: field issf; intensity singular; adhesive joints; stress field; issf; singular stress

Journal Title: International Journal of Adhesion and Adhesives
Year Published: 2019

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