Abstract In automotive applications, Cu/Al2O3/Cu compounds are widely used as substrates in electronic power devices due to their high thermal and electrical conductivity. The significance of this research are Vickers… Click to show full abstract
Abstract In automotive applications, Cu/Al2O3/Cu compounds are widely used as substrates in electronic power devices due to their high thermal and electrical conductivity. The significance of this research are Vickers hardness measurements that reveal the hardening of Cu in Cu/Al2O3/Cu compounds under thermal cycling for the first time. A key finding was that the Cu hardening dictates the characteristics of the observed crack propagation path. Using a kinematic and isotropic Cu hardening model in finite element simulations and a fracture mechanical modeling methodology, we were able to predict the crack path in very good agreement with experimental observations.
               
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