LAUSR

Abstract A novel micro-channels heat pipe technology which passively cools 3D chips was proposed. The micro-channels structure of 3D chips was used as the evaporating section of the heat pipe. The maximum heat flux and heat transfer coefficient of boiling in horizontal and inclined micro-channels were studied experimentally studied. Experiments were carried out using four kinds of working liquids: two pure fluids (deionized water and R113) and two super-moist fluids (deionized water + surfactant and R113 + surfactant). The height and gap of channels used were in the range of 30–90 mm and 30–100 μm, respectively. Experimental results show that horizontal and inclined micro-channels structure can also cause great natural convective boiling to cool 3D chip, simultaneously, super-moist fluids can significantly enhance both the maximum heat flux and heat transfer coefficient of boiling in micro-channels due to super-wettability of the liquids. The results show that the horizontal micro channel heat pipe structure is also a promising technology for 3D chip cooling.