LAUSR

Abstract Graded mesh inserts that spatially enhance the thermal conductivity of phase change materials (PCM) are optimized to minimize the time averaged thermal resistance between the heat source and the melt-front, to improve heat dissipation rates for electronics. Conventionally, the low thermal conductivities of PCM are enhanced by incorporating spatially-homogeneous porous fillers with high thermal conductivities. We investigate the relative advantages of porous fillers that spatially distribute enhancements to thermal conductivity. An arbitrary polynomial form of the spatial variation is optimized based on a numerical solution to the heat diffusion equation, to enhance heat dissipation rates in one-dimensional spherical and cylindrical coordinates. The most desirable spatial distributions are non-linear, have higher thermal conductivity near to the hot-spot, and a positive second derivative with respect to the radial coordinate (i.e. concave-up). We demonstrate enhancements of heat dissipation rates for constant temperature hot-spots, or reductions in temperature for constant power hot-spots, by factors of 900% and 300% in spherical and cylindrical coordinates, relative to those achieved by uniform fillers of equivalent average volume fractions. Recent advances in additive manufacturing make metal meshes with spatially graded volume fraction realizable.