LAUSR

Abstract The surface mount technology (SMT) has allowed to include more electronic components with different shapes and sizes on printed circuit boards (PCB), improving the storage capabilities, transmission rates, and data processing; also, some optical elements have been incorporated in their composition. Therefore, an evolution in the methods and processes of non-contact soldering is required to adhere the elements without damaging them. In the present paper is presented the irradiance analysis when a Variable Irradiation Mask (VIM) is inserted in the output of a focused infrared soldering system (FILSS) to obtain a different light distribution, which can be compared with the thermal distribution obtained in the electronic component that is being analyzed, a Ball Grid Array (BGA) in this case. The results of irradiance in the simulation are congruent with thermal distribution obtained experimentally in the study area of the target's surface. It is observed that at the borders with the VIM, 50% of the total intensity of the maximum termal distribution is obtained. The soldering quality in the electronic component can be correlated with the thermal distribution and irradiance in this system.