LAUSR

Abstract A general solution, based on the method of separation of variables, for the temperature distribution of an orthotropic rectangular substrate heated by heat sources on one side and cooled with a non-uniform heat transfer coefficient on the opposite side is presented. A system of infinitely many algebraic equations obtained by taking advantage of the orthogonality property is encountered and must be solved for the solution coefficients. An iteration method is proposed to overcome this difficulty. Such an analytical solution provides an easy and efficient way to explore the influence of relevant parameters. A fitting curve to the analytical predictions against interested parameters can be next obtained, if desired, to replace the troublesome infinite-series solution and employed in the resistor-capacitor thermal models for predicting the heat dissipation power of electronic packaging designs.