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Abstract A defect-free Sn-based metallization layer was prepared successfully on the surface of graphite at 950 °C for 30 min using Sn0.3Ag0.7Cu- 9%Cr (wt. %) metal powders. The typical interfacial microstructure of… Click to show full abstract
Abstract A defect-free Sn-based metallization layer was prepared successfully on the surface of graphite at 950 °C for 30 min using Sn0.3Ag0.7Cu- 9%Cr (wt. %) metal powders. The typical interfacial microstructure of the metallization interface was β-Sn/Cr3C2/graphite. The formation mechanism of Cr3C2 reaction layer was investigated in detail. Reliable soldered joint of metallized graphite to copper was achieved using Sn3Ag0.5Cu solder paste at 250 °C for 60 s in air, and the average shear strength of soldered joint reached 25 MPa. The novel metallization method provides a neoteric way for joining graphite and copper.
Journal Title: Journal of Alloys and Compounds
Year Published: 2017
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