LAUSR

Abstract An effective preparing approach of graphene-strengthening copper-based composites by a easy electrochemical deposition and atmosphere sintering is presented. The graphene-nanoplatelets/copper (GNP/Cu) powder shows homogenous dispersion of graphene in the matrix when the addition of graphene oxide (GO) is 25.0 mg/ml in the electrochemical deposited solution. The formation of the Ni decorating graphene nanoplatelets (Ni-GNP) and the oxygen-mediated Cu O C bond are promoted by electrochemical deposition. The crystal orientation relationship of ( 1 ¯ 1 1 ¯ ) C u / / ( 10 1 ¯ 0 ) G r a p h e n e and ( 222 ) N i / / ( 10 1 ¯ 0 ) G r a p h e n e is observed, and the lattice misfit ɛ* of Cu and graphene is 2.1%. The bond strength between copper and graphene is increased by Ni-GNPs, Cu O C and the coherent crystal orientation relationship. Taking advantage of the GNP/Cu powders prepared by electrochemical deposition, the GNP/Cu composites with the hardness of 111.2 HV and the conductivity of 89.2% IACS are prepared.