LAUSR

Abstract We investigated the interfacial reactions and mechanical reliabilities of different Ni layer thicknesses and P-containing Pd layers in thin electroless-Ni electroless-Pd immersion gold (thin-Au/Pd(P)/Ni(P)) surface-finished printed circuit board (PCBs) with Sn-3.0Ag-0.5Cu (SAC 305) solder joints. To analyze the optimal Ni layer thickness in the thin-Au/Pd(P)/Ni(P) for aging, we evaluated 0.3- to 1.0-μm Ni layers in thin-Au/Pd(P)/Ni(P) PCBs with SAC 305 solder joints aged at 75, 100, 125, and 150 °C for 1000 h. A scallop-type (Cu,Ni)6Sn5 intermetallic compound (IMC) dominantly formed at the bottom and top sides of the interfaces of all Ni joints under all aging conditions. Furthermore, a P-rich Ni layer formed at the interface between the (Cu,Ni)6Sn5 IMC and Cu substrate during aging regardless of Ni layer thickness. The (Cu,Ni)6Sn5 IMCs of the joints with 0.3- and 0.5-μm Ni layers aged at 125 and 150 °C for 1000 h were thicker than those of 0.7- and 1.0-μm Ni layers. In high-speed shear tests, the shear strength reduction rates of the joints with 0.3-μm Ni layer aged at 125 and 150 °C were higher than those of the 0.7- and 1.0-μm Ni layers. The brittle fracture rates of the joints with 0.3- and 0.5-μm Ni layers aged at 150 °C for 1000 h were higher than those of the 0.7- and 1.0-μm Ni layers. We determined that these trends arose from the diffusion barrier role of the relatively thick P-rich Ni layers maintained at the interfaces of the joints with 0.7- and 1.0-μm Ni layers for all aging temperatures and times. In low-speed shear tests, the shear strengths of the joints with 0.3-μm Ni layer were slightly lower than those of the 0.5- to 1.0-μm Ni layers. The low- and high-speed shear strengths of the joint with 0.7-μm Ni layer were similar to those of the 1.0-μm Ni layers for each condition. Therefore, Ni joint thicknesses of over 0.7 μm are expected to provide high reliability for aging.