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Abstract Solid-liquid interdiffusion (SLID) bonding was extensively investigated as a potential bonding method applied to 3D chip stacking because it can be bonded at a low temperature and used in… Click to show full abstract
Abstract Solid-liquid interdiffusion (SLID) bonding was extensively investigated as a potential bonding method applied to 3D chip stacking because it can be bonded at a low temperature and used in a high temperature. In this paper, the interfacial reactions and microstructure evolution between different substrates (Cu, Ni, Co, Ag, Au, etc.) and interlayer materials (Sn, In, SnIn, Ga) through SLID bonding in 3D-IC package interconnects were systematically reviewed. The addition of alloys/particles to the intermediate layer material to improve the voids in solder joints was also discussed. In addition, the application of SLID bonding technique, the formation of intermetallic compounds and microstructure evolution at the interface as well as the reliability of solder joints obtained by SLID were presented.
Journal Title: Journal of Alloys and Compounds
Year Published: 2020
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