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Abstract The temperature required for growth of mullite whiskers in heat-resistant adhesive was decreased to 700 °C based on solid-liquid-solid (S-L-S) mechanism. The bonding strength was increased by 23.1% (700 °C) ∼ 60.7% (1200 °C),… Click to show full abstract
Abstract The temperature required for growth of mullite whiskers in heat-resistant adhesive was decreased to 700 °C based on solid-liquid-solid (S-L-S) mechanism. The bonding strength was increased by 23.1% (700 °C) ∼ 60.7% (1200 °C), and the maximal 32.3 MPa was achieved after sintered at 1200 °C. Moreover, the whiskers-grown adhesive also displayed better anti-damage capacity, and multiple grading fractures occurred during the test procedure, which was mainly due to the pull-out mechanism.
Journal Title: Journal of Alloys and Compounds
Year Published: 2020
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