LAUSR

Abstract A room temperature curable heat-resistant adhesive with broad working temperature range was prepared through organic and inorganic modification. The preceramic polymethylsiloxane showed low bonding strength for silicon carbide from 400 °C to 600 °C because of the decomposition of polymer network. So the modification with epoxy resin was used to generate strong blending and copolymerization network which decomposed at higher temperature over 500 °C. The ceramization of active fillers and preceramic polymer compensated the bonding strength with rising temperature, thus eliminating the weak stage from 400 °C to 600 °C. The modification with fillers greatly improved its bonding strength at high temperature over 1000 °C. Consequently, the modified adhesive exhibited outstanding bonding strength tested at room temperature between 9.29 ± 0.56 MPa and 37.28 ± 1.33 MPa after heat-treatment from 25 °C to 1500 °C and the bonding strength directly tested at the temperature from 25 °C to 800 °C over 8.21 ± 0.40 MPa. The adhesive shows the potential to extend the application for engineering ceramic joining.