Abstract A new Au-Cu-Ti filler featuring superior mechanical properties was developed to enable the brazing of a SiCf/SiC composite (CMCs) to itself and a Ni-based superalloy (GH536). The progression of… Click to show full abstract
Abstract A new Au-Cu-Ti filler featuring superior mechanical properties was developed to enable the brazing of a SiCf/SiC composite (CMCs) to itself and a Ni-based superalloy (GH536). The progression of the interfacial reactions was studied using a combination of thermodynamic calculations and experimental observations. It was found that the interfacial reaction was Ti-dominant at the early brazing stage and then gradually transformed to Ni-dominant with the continuous dissolution of the GH536 substrate. Thus, the typical microstructure of GH536/Ti-Ni-Cr-Fe+(Au, Cu)ss + MoNiSi/Ni-Cr-Fe-Si-C (Ni2Si + Fe2Si + Cr3C2)+(Au, Cu)ss/Ni2Si + TiC+(Au, Cu)ss/ Cr3C2+Ni2Si + TiC + Fe2Si/CMCs could be described by the following three stages: a Ti-dominated stage, full interdiffusion stage, and Ni-dominated stage. A maximum shear strength of 36 MPa was obtained for joints brazed at 1050℃ for 10 min, at which a failure occurred at the CMCs/brazing seam interface. The control of the interfacial reactions and the stress relaxation of (Au, Cu)ss contributed to the superior mechanical performance of the composite.
               
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