LAUSR

Abstract Effect of distance between the explosive and the center of the sample on welded Sn/Cu interface was investigated. Distance was varied to change the pressure applied to the plates to be welded. Morphology of interfacial microstructures across welded Sn/Cu joints and their effect on mechanical behavior was also assessed. Interfacial microstructures revealed that, Sn and Cu plates can be successfully bonded using underwater explosive welding technique without formation intermetallic phases. Wavy interface was observed at the interface of welded Sn/Cu plates. Increase in the distance between the explosive and sample resulted reduction in the formation of wavy interface. Increase in the values of microhardness at the welded interface and gradually decrease in hardness away from the interface was observed.