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Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits

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Abstract Liquid metal (In75.4 Ga24.5, LM) with its high electrical conductivity and flexibility at room temperature, has been gradually introduced into printed electronics. However, the low adhesion effect of LM… Click to show full abstract

Abstract Liquid metal (In75.4 Ga24.5, LM) with its high electrical conductivity and flexibility at room temperature, has been gradually introduced into printed electronics. However, the low adhesion effect of LM on the common printer paper may restrict its potential value in reducing cost and expanding use. In this study, the surface property of the printer paper has been modified by a wetting method with a coating of micro-size droplets on the paper surface to realize a smooth writing process using the liquid metal ink. The current strategy is expected to enable future flexible electronic circuits on the hard writing substrates.

Keywords: paper; liquid metal; electronic circuits; metal ink; printer paper

Journal Title: Journal of the Taiwan Institute of Chemical Engineers
Year Published: 2019

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