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Microstructure evolution and bonding mechanism of Ti2SnC-Ti6Al4V joint by using Cu pure foil interlayer

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Abstract Ti 2 SnC, as one of functional ceramics with self-healing ability, was studied in welding with Ti6Al4V (TC4) through Cu interlayer under an applied mechanical pressure 10 MPa in Ar… Click to show full abstract

Abstract Ti 2 SnC, as one of functional ceramics with self-healing ability, was studied in welding with Ti6Al4V (TC4) through Cu interlayer under an applied mechanical pressure 10 MPa in Ar atmosphere. Electron probe microanalyses indicated that the outward diffusion of Sn from Ti 2 SnC played a critical role in the chemical composition of the joining interface. After 60 min, the reaction layers consisted of five zones: an interleaved zone (V) of β-Cu(Sn) and α-Cu(Sn), an enriched zone (IV) of Sn and intermetallic CuTi 0.5 Sn 0.5 phase, the intermetallic zones (III) and (II) composed of TiCu 4 and Ti 3 Cu 4 , a zone (I) consisting of β -Ti (Cu) phase. After shear tests, the corresponding fractographs indicated that the cracks mainly propagated in the Ti 2 SnC matrix with an intergranular fracture mode.

Keywords: evolution bonding; mechanism ti2snc; interlayer; microstructure evolution; ti6al4v; bonding mechanism

Journal Title: Materials Characterization
Year Published: 2017

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