LAUSR.org creates dashboard-style pages of related content for over 1.5 million academic articles. Sign Up to like articles & get recommendations!

Microstructure and tensile anisotropy of pure Ti processed by up-scaled RD-ECAP

Photo by jim_ahlberg from unsplash

Abstract In this work, rotary die equal channel angular pressing (RD-ECAP) was up-scaled to produce large CP-Ti billets with a cross section of 50 × 50 mm2 for 4 and 8 passes. Hardness… Click to show full abstract

Abstract In this work, rotary die equal channel angular pressing (RD-ECAP) was up-scaled to produce large CP-Ti billets with a cross section of 50 × 50 mm2 for 4 and 8 passes. Hardness distributions were measured on the longitudinal and cross sections of the billets after 4 and 8 passes. The tensile behaviors along three orthogonal directions were evaluated for the multi-pass samples. The microstructure and crystallographic texture of the RD-ECAP processed CP-Ti were examined and linked to its tensile anisotropy. The results showed that better hardness homogeneity was achieved after 8 passes than after 4 passes. The strength of as-received CP-Ti was improved after RD-ECAP for 4 and 8 passes, which was attributed to a refined microstructure and texture strengthening. However, the 4-pass sample exhibited obvious tensile anisotropy, resulting from crystallographic texture and deformation microstructure. After 8 passes, the tensile anisotropy was reduced, owing to the more uniform microstructure and weakening of the { 1 ¯ 2 1 ¯ 4}〈10 1 ¯ 0〉 and {01 1 ¯ 2}〈2 1 ¯ 1 ¯ 0〉 textures.

Keywords: ecap; anisotropy pure; tensile anisotropy; microstructure tensile; pure processed

Journal Title: Materials Characterization
Year Published: 2020

Link to full text (if available)


Share on Social Media:                               Sign Up to like & get
recommendations!

Related content

More Information              News              Social Media              Video              Recommended



                Click one of the above tabs to view related content.