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Abstract The electro-migration test of Sn-15Bi solder joint was conducted at 150 °C with a current density of 160 A/cm 2 . The near eutectic phase layer thickening as the extending of… Click to show full abstract
Abstract The electro-migration test of Sn-15Bi solder joint was conducted at 150 °C with a current density of 160 A/cm 2 . The near eutectic phase layer thickening as the extending of electro-migration time was observed on the anode side interface of Sn-15Bi solder joint. The Bi fraction of cathode side reduced as the increase of electro-migration time. The Bi atom of near eutectic phase layer was from solid solution Bi atom in β-Sn phase. The diffusion of Bi atom was up-hill diffusion under the effect of electron flow.
Keywords:
near eutectic;
phase;
15bi solder;
solder joint;
migration;
electro migration
Journal Title: Materials Letters
Year Published: 2017
Link to full text (if available)
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Journal Title: Materials Letters
Year Published: 2017
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!