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Abstract A novel Mg/TiNiCu composite was successfully fabricated from porous TiNiCu shape memory alloy (SMA) and pure Mg via non-pressure infiltration process with the aim of developing a new kind… Click to show full abstract
Abstract A novel Mg/TiNiCu composite was successfully fabricated from porous TiNiCu shape memory alloy (SMA) and pure Mg via non-pressure infiltration process with the aim of developing a new kind of high damping material with excellent mechanical properties. In order to restrain the formation of undesired Mg2Cu phase, the methods of short-time infiltration and rapid consolidation were adopted. Resultant material had homogenously distributed and 3D interconnected Mg particles in the TiNiCu matrix. Compared with porous TiNiCu SMA, in addition to the notable increase of storage modulus the damping property of Mg/TiNiCu composite was also obviously improved, which could be attributed to the superposition effect of multiple damping sources.
Journal Title: Materials Letters
Year Published: 2018
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