LAUSR

Abstract This paper introduces a novel method to moderate the residual stress in a YSZ/Ti6Al4V alloy by using novel CuO nanostructure reinforced Cu foam (N-Cu foam) interlayer. The microstructure of the CuO nanostructure reinforced Cu foam interlayer and the achieved brazing joint is characterised via scanning electron microscope (SEM), X-ray diffraction (XRD) and transmission electron microscopy (TEM). It is found that nano-CuO structures can be successfully fabricated on the skeleton of the Cu foam and the 3D porous structure of which survives after the brazing process. The achieved brazing seam mainly consists of Ag solid solution (Ag(s,s)), Cu solid solution (Cu(s,s)) and fine Ti3Cu3O secondary phases, which is found to be beneficial to release the thermal stress. The strength of the joint achieved with an N-Cu foam interlayer is 95.6 MPa, which is 83.1% higher than the joints brazed without interlayers.